Panel with releasable core

ABSTRACT

Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.

RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 14/135,168 with filing date Dec. 19, 2013, which isincorporated herein by reference in its entirety.

TECHNICAL FIELD

Examples generally relate to panel architectures and methods, such ascan be used in a substrate manufacturing process.

TECHNICAL BACKGROUND

Substrate manufacturing technology can include the use of panels to helpincrease the number of dies that can be manufactured at a given time.Substrate manufacturing can be inefficient, wasteful, or costprohibitive. Such problems can be prevalent when building substratesusing one or more panels.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

FIG. 1 shows a block diagram of an example of a core panel architecture.

FIG. 2 shows a block diagram of an example of the core panel of FIG. 1after being cut.

FIG. 3 shows a block diagram of an example of a core panel, according toone or more embodiments.

FIG. 4 shows a block diagram of another example of a core panel,according to one or more embodiments.

FIG. 5 shows a block diagram of another example of a core panel,according to one or more embodiments.

FIG. 6 shows a block diagram of another example of a core panel,according to one or more embodiments.

FIG. 7 shows a block diagram of the core panel of FIG. 6 with one ormore recesses cut into an outer layer of the core panel.

FIG. 8 shows a block diagram of the core panel of FIG. 6 or FIG. 7 afterpost-processing the core panel.

FIGS. 9A, 9B, and 9C each show a block diagram of a section of the corepanel of FIG. 8 after post-processing.

FIG. 10 shows an example of a technique for making a core panel.

FIG. 11 shows an example of a technique for making a core panel.

FIG. 12 shows an example of a computer system.

DESCRIPTION OF EMBODIMENTS

Examples in this disclosure relate generally to substrates or panels,such as panels that can include coreless or cored substrates builtthereon, and techniques of making and using the same. Examples alsorelate to systems that can include one or more of the substrates orpanels.

FIG. 1 shows an example of a core panel 100. The panel 100 can include abase 102, an inner foil 104A or 104B, an outer conductive foil 106A or106B, and a dielectric material 108A or 108B (e.g., an etch stop orbuild up material) with a die 110A or 110B situated on the outerconductive foil 106A-B and embedded at least partially in the dielectricmaterial 108A-B. The inner foil 104A-B and the outer conductive foil106A can include a width 112A or 112B that is smaller than a width 114Aor 114B of the outer conductive foil 106A-B or the base 102.

The base 102 can begin as a substantially rectangular structure and beprocessed to be generally “H” shaped, such as by forming a recess ineach side of the base 102. The inner foil 104A-B and the outerconductive foil 106A-B can be held in place, such as by vacuum sealing(e.g., hot pressing or pressing and curing) the outer conductive foil106A-B to the inner foil 104A-B and the base 102, such as in a vacuumenvironment. Vacuum sealing can also include subjecting the base 102,inner foil 104A-B, and the outer conductive foil 106A-B to higherpressure conditions than one bar, such as in the vacuum environment.

The inner foil 104A-B can include a width 112A or 112B that is smallerthan a width 114A or 114B of the outer conductive foil 106A-B. The innerfoil 104A-B can include a thickness 116A or 116B that is less than athickness 118A or 118B of the outer conductive foil 106A-B.

An advantage of the panel 100 is that two dies 110A-B can be (e.g.,simultaneously) mounted on the outer conductive foil 106A-B on each sideof the panel 100. The panel 100 can be cut, such as along the dottedlines 120A and 120B, to form the panel 200, such as shown in FIG. 2. Thedie 110A-B can be peeled away from the base 102, such as at theinterface 214 between the inner foil 104A-B and the outer conductivefoil 106A-B. The outer conductive foil 106A-B can be removed (e.g.,etched) from the dielectric material 108A-B, such as to leave just thedie 110A and the substrate (e.g., dielectric layers with traces, vias,interconnects, etc.) or package that the die 110 is built in or onto.

A disadvantage of the panel 100 can include thick (e.g., greater thaneighteen micrometers) inner foils and outer conductive foils increasingthe cost of the panel 100. The thicker conductive foils can helpalleviate effects of wrinkling or warping in the conductive foils in themanufacturing process, however, the thicker conductive foils areexpensive compared to thinner foils.

FIG. 3 shows an example of a core panel 300 according to one or moreembodiments. The core panel 300 can include a base 302, an inner foil304A or 304B, an adhesive layer 306A or 306B, or an outer conductivefoil 308A or 308B. The inner foil 304A-B can include a thickness 314A or314B that is less than a thickness 316A or 316B of the outer conductivefoil 308A-B (i.e. the outer conductive foil 308A-B can be thicker thanthe inner foil 304A-B).

The inner foil 304A-B and the outer conductive foil 308A-B can besubstantially the same width 310A or 310B. The inner foil 304A-B or theouter conductive foil 308A-B can be situated at least partially in arecess 318A or 318B of the base 302, such as shown in FIG. 3. Byincluding inner foil 304A-B and outer conductive foil 308A-B that aresituated at least partially in the base 302 (e.g., at least partially ina recess 318A or 318B of the base 302), an interface 312A or 312Bbetween the adhesive layer 306A-B and the inner foil 304A-B or outerconductive foil 308A-B can be protected from an external influence(e.g., force) that could shift or delaminate the outer conductive foil308A-B from the inner foil 304A-B. The interface 312A-B can be situatedin a recess 318A or 318B of the base 302, such as to protect theinterface 312A-B from the external influence. The external influence canbe introduced during a manufacturing process, such as manufacturing asubstrate, die, or package on or over the outer conductive foil 308A-B.The external influence can include a physical bump, a chemicalinteraction, or heat, among other external influences.

Arranging the adhesive layer 306A-B between the inner foil 304A-B andthe outer conductive foil 308A-B can allow the outer conductive foil308A-B to be peeled away from the inner foil 304A-B. However, with theadhesive layer 306A-B between the inner foil 304A-B and the outerconductive foil 308A, there is a risk that the outer conductive foil308A-B will be delaminated from the inner foil 304A-B. By positioningthe interface 312A-B of the adhesive layer 306A-B and the inner foil304A-B or outer conductive foil 308A-B in the recess 318A-B of the base302, the interface 312A-B can be protected (e.g., shielded) from theexternal influence.

If the interface 312A-B is not protected, the inner foil 304A-B or theouter conductive foil 308A-B can be damaged, warped, or otherwisedeformed during a manufacturing process. Also, if the interface 312A-Bis not protected, the outer conductive foil 308A-B can be prematurelyreleased from the inner foil 304A-B during a manufacturing process. Themanufacturing process can include at least partially building asubstrate on the top or bottom of the panel 300, such as at an outersurface of the outer conductive foil 308A-B.

The base 302 can include a material that is rigid enough to withstandprocessing at a substrate manufacturing factory and retain shape. In oneor more embodiments, the base 302 can include a material impregnatedwith a polymer. In one or more embodiments, the base 302 can include acarbon material impregnated with an epoxy or resin. In one or moreembodiments, the base 302 can include a metal, plastic, or othersubstantially rigid material. The base 302 can be generally “H” shapedor, in an embodiment in which one substrate is to be manufactured on thepanel, the panel can be generally “u” shaped with a recess in only oneside of the base 302.

The inner foil 304A-B can be affixed to the base 302. The inner foil304A-B can include a conductive material such as copper, gold, silver,aluminum, a combination thereof, or other conductive material. In one ormore embodiments, the thickness 314A-B of the inner foil 304A-B can bebetween about one and thirty micrometers. In one or more embodiments,the thickness 314A-B of the inner foil 304A-B can be between about twoand fifteen micrometers. In one or more embodiments, the thickness314A-B of the inner foil 304A-B can be between about two and sixmicrometers. In one more embodiments, the thickness 314A-B of the innerfoil 304A-B can be between about three and five micrometers. In one ormore embodiments, the thickness 314A-B of the inner foil 304A-B can beabout five micrometers.

The adhesive layer 306A-B can releasably couple the outer conductivefoil 308A-B or to the inner foil 304A-B. The adhesive layer 306A-B caninclude an epoxy, resin, a combination thereof, or other material. Theadhesive layer 306A-B can be pressed (e.g., hot pressed, baked withpressure, or laminated) into the inner foil 304A-B. Such pressing canhelp provide a releasable coupling between the inner foil 304A-B and theouter conductive foil 308A-B, such as shown in FIG. 3.

The base 302 and the outer conductive foil 308A-B can be releasablyuncoupled, such as by mechanically removing (e.g., pulling) the outerconductive foil 308A-B away from the inner foil 304A-B. The outerconductive foil 308A-B can be removed from the inner foil 304A-B after asubstrate has been manufactured on the panel 300 (see FIG. 6).

The adhesive layer 306A-B can include a methyl ethyl ketone and toluenesolvent with polydimethyl siloxane and bisphenol A based epoxy. Anadhesive layer 306A-B made from these materials can suffer from phaseseparation between the epoxy and silicone over time. Heat can causeblisters to form in the adhesive layer 306A-B made from these materials.The adhesive strength of such adhesive layer 306A-B can degrade overtime. An adhesive layer made of these materials can have poor lineyields, such as in a SPTD factory.

As used herein releasably coupling means to couple such that amechanical coupling through the adhesive layer 306A-B can be brokenwithout requiring excessive force or damaging the items mechanicallycoupled through the adhesive layer 306A-B. The adhesive layer 306A-B canbe released from an item by exerting a relatively small amount of force,such as about five Newtons per meter to about one hundred Newtons permeter on or near the adhesive layer 306A-B.

The adhesive layer 306A-B can include one or more epoxy siliconecopolymers or blends of polymers, silicone, or epoxy. Different blendscan be used to make adhesive layer 306A-B with varying mechanicalproperties, such as depending on the volume weight percent of polymer,silicone, or epoxy used. The mechanical properties can include hardness,elasticity, stickiness, or other mechanical property.

The adhesive layer 306A-B can include an epoxy and silicone blend. Forexample, siloxane and epoxy resin can be blended together with acarboxylic acid anhydride hardener, such as to produce a stable orwell-blended adhesive layer 306A-B. This blend can be used as anadhesive by controlling the siloxane to epoxy resin ratio. By increasingthe proportion of siloxane, an adhesive layer 306A-B with a reducedelastic modulus can be produced.

The adhesive layer 306A-B can include a blend of co-polymer, epoxy, orsilicone. A co-polymer of siloxane and epoxy can be produced and mixedwith an epoxy resin. Polysiloxane can have an epoxide group on a sidechain thereof and can be synthesized from methylhydrosiloxane, epoxyresin.

The outer conductive foil 308A-B can be releasably coupled to the innerfoil 304A-B, such as through the adhesive layer 306A-B. The outerconductive foil 308A-B can include a conductive material such as copper,gold, silver, aluminum, a combination thereof, or other conductivematerial. The outer conductive foil 308A-B can include a thickness316A-B that is greater than the thickness 314A-B of the inner foil304A-B.

In one or more embodiments, the outer conductive foil 308A-B can includea thickness 316A-B of between about ten and forty micrometers. In one ormore embodiments, the outer conductive foil 308A-B can include athickness 316A-B of between about fifteen and twenty micrometers. In oneor more embodiments, the outer conductive foil 308A-B can include athickness 316A-B of about eighteen micrometers.

FIG. 4 shows a block diagram of a panel 400 that is similar to the panel300 with a dielectric material 410A or 410B, a conductive foil 412A or412B, or a die substrate 414A or 414B situated on or over the base 302.The dielectric material 410A-B can include an etch stop layer or abuildup film, such as an Ajinomoto Buildup Film (ABF). The conductivefoil 412A-B can be substantially similar to the inner foil 304A-B or theouter conductive foil 308A-B with the conductive foil 412A-B including awidth 416 that is greater than the width 310A-B of the inner foil 304A-Bor the outer conductive foil 308A-B. The dielectric material 410A-B andthe conductive foil 412A-B can be jointly considered a resin coatedconductive layer.

The die substrate 414A-B can be situated on a top surface or a bottomsurface of the panel 400. The die substrate 414A-B can be situated atleast partially in the conductive foil 412A-B. The die substrate 414A-Bcan be situated on the outer conductive foil 308A-B.

While one die is shown in FIG. 4, multiple dies can be situated on thetop surface or the bottom surface of the core panel 400. The diesubstrate 414A-B can be formed on the outer conductive foil 308A-B,respectively. The substrate 414A-B can include a Bumpless BuildUp Layer(BBUL) substrate, a Flip Chip substrate, a Surface Mount (SMT)substrate, or other type of substrate.

The die substrate 414A-B can include a cored die substrate, coreless diesubstrate, or a Bumpless Buildup Layer (BBUL) die substrate. A corelessdie substrate can include a substrate that is built up and a die isattached to the die substrate after the die substrate is built. A coreddie substrate can include a substrate that includes a die arranged inthe substrate and at least a portion of the substrate is built aroundthe die. A BBUL die substrate can include a substrate that includes adie with one or more buildup layers built above the die to form the diesubstrate.

The die substrate 414A-B can be released from (e.g., pulled off of orotherwise removed from) the panel 400, such as at the adhesive layer306A-B. The panel 300 can be cut, such as to expose the interface312A-B. The outer conductive foil 308A-B can be separated from the corepanel 400, such as after the interface 312A-B has been exposed.

FIG. 5 shows an example of a panel 500 according to one or moreembodiments. The panel 500 can be configured to protect an interfacebetween an adhesive layer 506A or 506B and an inner foil 504A or 504B oran outer conductive foil 508A or 508B (e.g., the area of the panel 500covered by a protective material 512A, 512B, 512C, or 512D). The panel500 can include a base 502, the inner foil 504A-B, the adhesive layer506A-B, the outer conductive foil 508A-B, a die 510A or 510B, or theprotective material 512A-D.

The base 502 can include material similar to the base 302. The base 502can be substantially rectangular. The inner foil 504A-B can includematerial similar to the material of the inner foil 304A-B. A peripheryof the inner foil 504A-B can be substantially flush with a periphery ofthe base 502, such as shown in FIG. 5. The outer conductive foil 508A-Bcan include material similar to the material of the outer conductivefoil 308A-B. A periphery of the outer conductive foil 508A-B can besubstantially flush with a periphery of the base 502 or a periphery ofthe inner foil 304A-B, such as shown in FIG. 5.

The protective material 512A-D can be situated on the side of the panel500 to protect an interface between the adhesive layer 506A-B and theouter conductive foil 508A-B or the inner foil 304A-B. The protectivematerial 512A-D can help protect the interface from chemicals, heat,bumping, or other external forces that can delaminate or damage thematerial behind the protective material 512A-D. The protective material512A-D can include a metal, polymer, or other material that can adhereto the panel 500, such as at the inner foil 504A-B, the outer conductivefoil 508A-B, the adhesive layer 506A-B, or the base 502.

Processing required to make the panel 500 can be simpler or cheaper thanthe processing to make the panel 300. The processing can be simpler inthat the inner foil 504A-B and the outer conductive foil 508A-B need notbe processed to fit in a recess 318A-B of the base 302. Also, the base502 does not need to be processed to include a recess in which the innerfoil 304A-B or the outer conductive foil 308A-B can be situated in. Byremoving a processing step, the cost of manufacturing the panel 500 canbe reduced. Manufacturing the panel 500 can be simpler than processingto make the panel 300 because the panel 500 does require the precisealignment considerations as in the manufacturing of the panel 300.

The panel 500 can be processed, such as to include dielectric material514A-B over or around the substrate die 510A-B. Such embodiments can beconsidered “fully embedded” architectures, because the die 510A-B can befully embedded in the build-up film (e.g., dielectric) layer(s). The die510A-B can be separated from the panel 500 using a process similar tothe process shown in FIGS. 7, 8, 9A, 9B, and 9C.

FIG. 6 shows an example of a panel 600 according to one or moreembodiments. The panel 600 can be similar to the panel 500 with thepanel 600 including a resin coated conductive layer (e.g., a conductivefoil 616A or 616B on a dielectric material 614A or 614B) situated on theouter conductive foil 508A-B). The panel 600 can allow a partiallyembedded die substrate to be manufactured on the panel 600. The die canbe considered partially embedded because the dielectric film only coversa portion of the die. The conductive foil that includes the recesstherein that the die is inserted into can help cover the remainder ofthe die.

FIG. 7 shows the panel 700 that includes a recess 718A or 718B cut(e.g., etched) into the conductive foil 616A-B. A die 510A-B can besituated in the recess 718A-B, such as shown in FIG. 8. A dielectricmaterial 818A-B can be situated on or around the die 510A-B or theconductive foil 616A-B. The panel 700 can be cut, such as at the dottedlines 720A-B, to remove the protective material 512A-D or a portion ofthe base 502, inner foil 504A-B, adhesive layer 506A-B, outer conductivefoil 508A-B, dielectric material 614A-B, or conductive foil 616A-B. Theresulting panel 800, after the panel 700 is cut, is shown in FIG. 8.

FIG. 9A shows the panel portion 900A that is a portion of the panel 800that has been delaminated from the panel 800, such as at the adhesivelayer 506A. The panel portion 900A can be released from the remainder ofthe panel 800 such as at the releasable coupling between the inner foil504A and the outer conductive foil 508A. The outer conductive foil 508Acan be removed (e.g., chemically removed such as by copper etching, ormechanically removed such as by blasting, shaving, or cutting the outerconductive foil 508A) from the panel portion 900A, such as shown in FIG.9B. The dielectric material 614A can be removed (e.g., by wet blasting,shaving, or cutting the dielectric material 614A) from the die 510Asubstrate, such as is shown in FIG. 9C.

Note that while embodiments of panels discussed herein are double-sided(i.e. the panels include an inner foil, adhesive layer, and outerconductive foil all situated on opposite sides of the base), the panelcan be one-sided. One sided panels are less efficient in terms ofthroughput, but can include simpler processing at a manufacturingfacility.

An advantage of a panel discussed herein can include reduced cost ascompared to the panel 100. The reduced cost can be due, at least inpart, to the reduced cost in inner foil and outer conductive foilmaterials, since the conductive foils can be thinner than the conductivefoils of the panel 100. Another advantage can include reduced warping orwrinkling in the conductive foils. The reduction in wrinkling or warpingcan be due to the protective material 512A-D or the recess 318A-Bprotecting an interface between the adhesive layer and the inner foil orthe outer conductive foil. Another advantage can include assembling alarge panel and cutting the larger panel down into smaller panels formanufacturing.

The fully embedded architecture or the partially embedded architecturecan be manufactured by situating the materials in the proper order andlocation (such as is shown in FIGS. 3-7) and pressing (e.g., hotpressing) the materials. The partially embedded architecture can bemanufactured by manufacturing the fully embedded architecture and thenpressing (e.g., hot pressing) the resin coated conductive layer on thefully embedded architecture.

FIG. 10 shows a flow diagram of an example of a technique 1000 of makinga panel according to one or more embodiments. At 1002, a first innerfoil can be situated in a first recess of a base. At 1004, an adhesivelayer can be situated on the first inner foil or in the first recess. At1006, a first outer conductive foil can be releasably coupled to thefirst inner foil, such as through the adhesive layer. The first outerconductive foil can be situated at least partially in the first recess.The first outer conductive foil can include a width that issubstantially the same as a width of the first inner foil.

The base can include a second recess therein, the second recess in aside of the base that is opposite the first recess. situating a secondinner foil in the second recess. The technique 1000 can includesituating a second inner foil in the second recess. The technique 1000can include situating a second adhesive layer on the second inner foiland in the second recess. The technique 1000 can include releasablycoupling a second outer conductive foil to the second inner foil, suchas through the adhesive layer. The second outer conductive foil can besituated at least partially in the second recess. The second outerconductive foil can include a width that is substantially the same as awidth of the second inner foil.

The technique 1000 can include situating a first die on the first outerconductive foil. The technique 1000 can include encasing the first diein a first dielectric material. The technique 1000 can include situatinga second dielectric material on the first outer conductive foil. Thetechnique 1000 can include situating an outermost conductive foil on thesecond dielectric material. A width of the outermost conductive foil issubstantially the same as a width of the base.

The technique 1000 can include situating a second die at least partiallyin a third recess, the third recess in the outermost conductive foil.The technique 1000 can include encasing the second die, at leastpartially in a second dielectric material.

FIG. 11 shows a flow diagram of an example of a technique 1100 of makinga panel according to one or more embodiments. At 1102, an inner foil canbe coupled to a base. At 1104, an adhesive layer can be situated on theinner foil. The inner foil can be substantially flush with a peripheryof the base. At 1106, an outer conductive foil can be situated on theadhesive layer. A periphery of the outer conductive foil can besubstantially flush with a periphery of the inner foil.

At 1108, an interface between the adhesive layer, the inner foil, or theouter conductive foil can be covered with a protective material.Covering the interface can include flowing the protective material overthe interface. The protective material can include copper. The technique1100 can include situating a resin coated copper layer on the outerconductive foil. The technique 1100 can include embedding, at leastpartially, a die in the resin coated copper layer. The technique 1100can include situating a dielectric material over the resin coated copperlayer so as to at least partially encase the die in the dielectricmaterial. The technique 1100 can include situating a die substrate onthe outer conductive foils. The die substrate can be a corelesssubstrate, cored substrate, or a Bumpless Buildup Layer (BBUL)substrate.

FIG. 12 is a block diagram illustrating an example computer system 1200machine which can include a substrate that was built on a panel asdiscussed herein. Computer system 1200 can be a computing device. In anexample, the machine can operate as a standalone device or can beconnected (e.g., via a cellular network) to other machines. In anetworked deployment, the machine can operate in the capacity of eithera server or a client machine in server-client network environments, orit can act as a peer machine in peer-to-peer (or distributed) networkenvironments. Further, while only a single machine is illustrated, theterm “machine” shall also be taken to include any collection of machinesthat individually or jointly execute a set (or multiple sets) ofinstructions to perform any one or more of the methodologies discussedherein.

Example computer system 1200 can include a processor 1202 (e.g., aCentral Processing Unit (CPU), a Graphics Processing Unit (GPU) orboth), a main memory 1204 and a static memory 1206, which communicatewith each other via an interconnect 1208 (e.g., a link, a bus, etc.).The computer system 1200 can further include a video display unit 1210,an alphanumeric input device 1212 (e.g., a keyboard), and a UserInterface (UI) navigation device 1214 (e.g., a mouse). In an example,the video display unit 1210, input device 1212 and UI navigation device1214 are a touch screen display. The computer system 1200 canadditionally include a storage device 1216 (e.g., a drive unit), asignal generation device 1218 (e.g., a speaker), an output controller1232, a power management controller 1234, and a network interface device1220 (which can include or operably communicate with one or moreantennas 1230, transceivers, or other wireless communications hardware),and one or more sensors 1228, such as a GPS sensor, compass, locationsensor, accelerometer, or other sensor. The antennas 1230 can be coupledto a network 1226. Any of the items of the system 1200 can include asubstrate that was built on a panel discussed herein.

Examples and Notes

The present subject matter may be described by way of several examples.

Example 1 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use a panel including(1) a base including a first recess therein, (2) a first inner foilsituated in the recess, (3) a first adhesive layer situated on the firstinner foil and in the recess, and (4) a first outer conductive foilreleasably coupled to the first inner foil through the adhesive layer,the first outer conductive foil situated at least partially in therecess and including a width that is substantially the same as a widthof the first inner foil.

Example 2 can include or use, or can optionally be combined with thesubject matter of Example 1 to include or use, wherein the base includesa second recess therein, the second recess in a side of the base that isopposite the first recess, the panel can include (1) a second inner foilsituated in the second recess, (2) a second adhesive layer situated onthe second inner foil and in the second recess, and a second outerconductive foil releasably coupled to the second inner foil through theadhesive layer, the second outer conductive foil situated at leastpartially in the second recess and including a width that issubstantially the same as a width of the second inner foil.

Example 3 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 1-2 to include or use a firstdie situated on the first outer conductive foil.

Example 4 can include or use, or can optionally be combined with thesubject matter of Example 3 to include or use a first dielectricmaterial encasing the first die.

Example 5 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 1-2 to include or use asecond dielectric material situated on the first outer conductive foiland an outermost conductive foil situated on the second dielectricmaterial, wherein a width of the outermost conductive foil issubstantially the same as a width of the base.

Example 6 can include or use, or can optionally be combined with thesubject matter of Example 5 to include or use a third recess in theoutermost conductive foil and a second die situated at least partiallyin the third recess.

Example 7 can include or use, or can optionally be combined with thesubject matter of Example 6 to include or use a second dielectricmaterial at least partially encasing the second die.

Example 8 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 1-7 to include or use,wherein the first inner foil includes a first thickness and the firstouter conductive foil includes a second thickness, the first thicknesssmaller than the second thickness.

Example 9 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use (1) situating afirst inner foil in a first recess of a base, (2) situating a firstadhesive layer on the first inner foil and in the first recess, or (3)releasably coupling a first outer conductive foil to the first innerfoil through the adhesive layer, the first outer conductive foilsituated at least partially in the first recess and including a widththat is substantially the same as a width of the first inner foil.

Example 10 can include or use, or can optionally be combined with thesubject matter of Example 9 to include or use, wherein the base includesa second recess therein, the second recess in a side of the base that isopposite the first recess. Example 10 can include or use (1) situating asecond inner foil in the second recess, (2) situating a second adhesivelayer on the second inner foil and in the second recess, or (3)releasably coupling a second outer conductive foil to the second innerfoil through the adhesive layer, the second outer conductive foilsituated at least partially in the second recess and including a widththat is substantially the same as a width of the second inner foil.

Example 11 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 9-10 to include or use,situating a first die on the first outer conductive foil.

Example 12 can include or use, or can optionally be combined with thesubject matter of Example 11 to include or use, encasing the first diein a first dielectric material.

Example 13 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 9-10 to include or use,situating a second dielectric material on the first outer conductivefoil and situating an outermost conductive foil on the second dielectricmaterial, wherein a width of the outermost conductive foil issubstantially the same as a width of the base.

Example 14 can include or use, or can optionally be combined with thesubject matter of Example 13 to include or use situating a second die atleast partially in a third recess, the third recess in the outermostconductive foil.

Example 15 can include or use, or can optionally be combined with thesubject matter of Example 14 to include or use encasing the second die,at least partially in a second dielectric material.

Example 16 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use a panel including(1) a substantially rectangular base, (2) an inner foil mechanicallycoupled to the base, (3) an adhesive layer situated on the conductivefoil, (4) an outer conductive foil situated on the adhesive layer, (5)protective material covering an interface between the adhesive layer,the inner foil and the outer conductive foil, or (6) wherein the innerfoil includes a periphery that is substantially flush with a peripheryof the base.

Example 17 can include or use, or can optionally be combined with thesubject matter of Example 16 to include or use, wherein the protectivematerial includes copper.

Example 18 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 16-17 to include or use,wherein the outer conductive foil includes a periphery that issubstantially flush with a periphery of the inner foil.

Example 19 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 16-18 to include or use,wherein the inner foil includes a thickness that is less than athickness of the outer conductive foil.

Example 20 can include or use, or can optionally be combined with thesubject matter of Example 19 to include or use, wherein the thickness ofthe inner foil is between about three and six micrometers.

Example 21 can include or use, or can optionally be combined with thesubject matter of Example 20 to include or use, wherein the thickness ofthe inner foil is about five micrometers.

Example 22 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 16-21 to include or use,wherein the thickness of the outer conductive foil is between aboutfifteen and twenty micrometers.

Example 23 can include or use, or can optionally be combined with thesubject matter of Example 22 to include or use, wherein the thickness ofthe outer conductive foil is about eighteen micrometers.

Example 24 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 16-23 to include or use, aresin coated copper layer situated on the outer conductive foil.

Example 25 can include or use, or can optionally be combined with thesubject matter of Example 24 to include or use, a die at least partiallyembedded in the resin coated copper layer, and a dielectric materialsituated over the resin coated copper layer and at least partiallyencasing the die.

Example 26 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 16-25 to include or use, asubstrate situated on the outer conductive foil.

Example 27 can include or use, or can optionally be combined with thesubject matter of Example 26 to include or use, wherein the substrate isa coreless substrate, cored substrate, or a Bumpless Buildup Layer(BBUL) substrate.

Example 28 can include or use subject matter (such as an apparatus, amethod, a means for performing acts, or a device readable memoryincluding instructions that, when performed by the device, can cause thedevice to perform acts), such as can include or use (1) coupling aninner foil to a base, (2) situating an adhesive layer on the inner foil,such that the inner foil is substantially flush with a periphery of thebase, (3) situating an outer conductive foil on the adhesive layer, or(4) covering an interface between the adhesive layer, the inner foil andthe outer conductive foil with a protective material.

Example 29 can include or use, or can optionally be combined with thesubject matter of Example 28 to include or use, wherein covering theinterface includes flowing the protective material over the interface,or wherein the protective material includes copper.

Example 30 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 28-29 to include or use,wherein situating the outer conductive foil includes situating the outerconductive foil such that a periphery of the outer conductive foil issubstantially flush with a periphery of the inner foil.

Example 31 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 28-30 to include or usesituating a resin coated copper layer on the outer conductive foil.

Example 32 can include or use, or can optionally be combined with thesubject matter of Example 31 to include or use embedding, at leastpartially, a die in the resin coated copper layer, or situating adielectric material over the resin coated copper layer so as to at leastpartially encase the die in the dielectric material.

Example 33 can include or use, or can optionally be combined with thesubject matter of at least one of Examples 28-32 to include or usesituating a die substrate on the outer conductive foil.

Example 34 can include or use, or can optionally be combined with thesubject matter of Example 33 to include or use, wherein the diesubstrate is a coreless substrate, cored substrate, or a BumplessBuildup Layer (BBUL) substrate.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which methods,apparatuses, and systems discussed herein can be practiced. Theseembodiments are also referred to herein as “examples.” Such examples caninclude elements in addition to those shown or described. However, thepresent inventors also contemplate examples in which only those elementsshown or described are provided. Moreover, the present inventors alsocontemplate examples using any combination or permutation of thoseelements shown or described (or one or more aspects thereof), eitherwith respect to a particular example (or one or more aspects thereof),or with respect to other examples (or one or more aspects thereof) shownor described herein.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

As used herein, a “-” (dash) used when referring to a reference numbermeans “or”, in the non-exclusive sense discussed in the previousparagraph, of all elements within the range indicated by the dash. Forexample, 103A-B means a nonexclusive “or” of the elements in the range{103A, 103B}, such that 103A-103B includes “103A but not 103B”, “103Bbut not 103A”, and “103A and 103B”.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. §1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

What is claimed is:
 1. A panel comprising: a base including a firstrecess therein; a first inner foil situated in the recess; a firstadhesive layer situated on the first inner foil and in the recess; and afirst outer conductive foil releasably coupled to the first innerconductive foil through the adhesive layer, the first outer conductivefoil situated at least partially in the recess and including a widththat is substantially the same as a width of the first inner foil. 2.The panel of claim 1, wherein the base includes a second recess therein,the second recess in a side of the base that is opposite the firstrecess, the panel further comprising: a second inner foil situated inthe second recess; a second adhesive layer situated on the second innerfoil and in the second recess; and a second outer conductive foilreleasably coupled to the second inner conductive foil through theadhesive layer, the second outer conductive foil situated at leastpartially in the second recess and including a width that issubstantially the same as a width of the second inner foil.
 3. The panelof claim 1, further comprising a first die situated on the first outerconductive foil.
 4. The panel of claim 3, further comprising a firstdielectric material encasing the first die.
 5. The panel of claim 1,further comprising a second dielectric material situated on the firstouter conductive foil and an outermost conductive foil situated on thesecond dielectric material, wherein a width of the outermost conductivefoil is substantially the same as a width of the base.
 6. The panel ofclaim 5, further comprising a third recess in the outermost conductivefoil and a second die situated at least partially in the third recess.7. The panel of claim 6, further comprising a second dielectric materialat least partially encasing the second die.
 8. A method comprising:situating a first inner foil in a first recess of a base; situating afirst adhesive layer on the first inner foil and in the first recess;and releasably coupling a first outer conductive foil to the first innerconductive foil through the adhesive layer, the first outer conductivefoil situated at least partially in the first recess and including awidth that is substantially the same as a width of the first inner foil.9. The method of claim 8, wherein the base includes a second recesstherein, the second recess in a side of the base that is opposite thefirst recess, the method further comprising: situating a second innerfoil in the second recess; situating a second adhesive layer on thesecond inner foil and in the second recess; and releasably coupling asecond outer conductive foil to the second inner foil through theadhesive layer, the second outer conductive foil situated at leastpartially in the second recess and including a width that issubstantially the same as a width of the second inner foil.
 10. Themethod of claim 8, further comprising situating a first die on the firstouter conductive foil.
 11. The method of claim 10, further comprisingencasing the first die in a first dielectric material.
 12. The method ofclaim 8, further comprising situating a second dielectric material onthe first outer conductive foil and situating an outermost conductivefoil on the second dielectric material, wherein a width of the outermostconductive foil is substantially the same as a width of the base. 13.The method of claim 12, further comprising: situating a second die atleast partially in a third recess, the third recess in the outermostconductive foil; and encasing the second die, at least partially in asecond dielectric material.
 14. A panel comprising: a substantiallyrectangular base; an inner foil mechanically coupled to the base; anadhesive layer situated on the conductive foil; an outer conductive foilsituated on the adhesive layer; and protective material covering aninterface between the adhesive layer, the inner foil and the outerconductive foil, wherein the inner foil includes a periphery that issubstantially flush with a periphery of the base.
 15. The panel of claim14, wherein the protective material includes copper.
 16. The panel ofclaim 14, wherein the outer conductive foil includes a periphery that issubstantially flush with a periphery of the inner foil.
 17. The panel ofclaim 14, wherein the inner foil includes a thickness that is less thana thickness of the outer conductive foil.
 18. The panel of claim 14,further comprising a resin coated copper layer situated on the outerconductive foil.
 19. The panel of claim 18, further comprising: a die atleast partially embedded in the resin coated copper layer; and adielectric material situated over the resin coated copper layer and atleast partially encasing the die.
 20. A method comprising: coupling aninner foil to a base; situating an adhesive layer on the inner foil,such that the inner foil is substantially flush with a periphery of thebase; situating an outer conductive foil on the adhesive layer; andcovering an interface between the adhesive layer, the inner foil and theouter conductive foil with a protective material.
 21. The method ofclaim 20, wherein covering the interface includes flowing the protectivematerial over the interface, wherein the protective material includescopper.
 22. The method of claim 20, wherein situating the outerconductive foil includes situating the outer conductive foil such that aperiphery of the outer conductive foil is substantially flush with aperiphery of the inner foil.
 23. The method of claim 20, furthercomprising situating a resin coated copper layer on the outer conductivefoil.
 24. The method of claim 23, further comprising: embedding, atleast partially, a die in the resin coated copper layer; and situating adielectric material over the resin coated copper layer so as to at leastpartially encase the die in the dielectric material.
 25. The method ofclaim 20, further comprising: situating a die substrate on the outerconductive foil.